ISP (pinout) VIVO V60 Lite 5G ISP Pinout

[Filesupport]

Vivo V60 Lite 5G (Model: V2529 / PD2529) UFS ISP Pinout & Service Guide​

The Vivo V60 Lite 5G is powered by the MediaTek Dimensity 7360 platform paired with UFS 3.1 storage. Direct ISP (In-System Programming) allows technicians to interface directly with the UFS storage bus without desoldering the memory chip (Chip-off), primarily used for dead-boot repair, full partition dump extraction, and low-level diagnostic recovery.

UFS ISP Pin Definition ​

Because this device utilizes high-speed differential pairs for UFS storage rather than parallel eMMC buses, standard CLK / CMD / DAT0 lines do not apply. The pinout consists of UFS differential communication lines:

Pin Label	Function	Connection Details
TX0_P	Transmit Differential Data Positive	Solder jumper to designated test point / series resistor
TX0_N	Transmit Differential Data Negative	Solder jumper to designated test point / series resistor
RX0_P	Receive Differential Data Positive	Solder jumper to designated test point / series resistor
RX0_N	Receive Differential Data Negative	Solder jumper to designated test point / series resistor
RST	Hardware UFS Reset Line	Solder jumper to test point / pull-up resistor
GND	System Ground	Connect to motherboard EMI shield or broad ground plane
VCC / VCCQ	Storage Power Rails	Typically supplied via USB-C cable (recommended) or direct 3.3V / 1.8V jumpers

Compatible Hardware Programmers​

• EasyJTAG Plus (with UFS BGA / ISP Socket Adapter)
• Medusa Pro II (with UFS ISP interface)
• UFI-Box (UFS Prog edition)
• Mipi Tester Box

Hardware ISP Connection Procedure​

Hardware Risk Warning
UFS differential lines operate at high frequencies and are extremely sensitive to trace resistance and heat. Excessive soldering iron temperature or wires longer than 5–7 cm will degrade signal integrity and cause read/write packet errors.

1. Motherboard Preparation:
   
   • Disconnect the battery and all camera modules to avoid electrical short-circuits and ESD damage.
   • Remove the mainboard from the housing.
   • Carefully desolder or cut the EMI shield covering the MediaTek SoC and UFS area using low-melt solder or a precision rotary cutter (avoid heat warping the board).
   • Clean the test point area using 99% Isopropyl Alcohol (IPA).
   • Use high-grade flux and ultra-fine enameled copper jumper wire (0.08 mm – 0.1 mm).
   • Run direct jumpers for TX0_P, TX0_N, RX0_P, RX0_N, and RST.
   • Connect GND using a thicker wire (0.2 mm) to any stable grounding shield.
   • Verification: Check for continuity and ensure there are no bridges between differential pairs (TX0_P vs TX0_N and RX0_P vs RX0_N) using a multimeter in diode/resistance mode.